
Memory manufacturers including Micron and Samsung have already announced their Intel P35 Certified DDR3 chips and now it’s time to check out what memory integrators have to offer. OCZ Technology, one of the leading memory integrators, also becomes one of the first companies to release DDR3 memories for Intel’s P35 chipset with their new line-up of PC3-8500 (1066MHz) and PC3-10666 (1333MHz) modules.
"For the past few years, we have highly anticipated DDR3, since it is everything DDR2 should have been from the very beginning," said Michael Schuette, vice president of technology development at OCZ, in a statement. "Being part of the task group defining the serial presence detect and extended feature set of DDR3 has further increased our commitment to the third generation of double data rate memory and we are ready to break some new performance records."
These new products will be available in 2x512MB and 2x1024MB dual channel kits and OCZ mentioned that, in the initial phase, these products will stick to JEDEC’s specifications for third generation Double Data Rate memory. Thus, the high-end solution represented by the PC3-10666 Gold Series modules features 1333MHz clocks with CL9-9-9-24 latencies. However, recent tests have demonstrated that latencies could be lowered to 7-7-7-21, while memory clocks could go as high as 1500 MHz or even 2000 MHz in dual channel mode.
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